Rechter.
Abstract 3D illustration of a transparent electronic chip or sensor board connected to a bundle of glowing fiber-like lines on a dark background.

Teramount

Series B

What good are faster chips if they can’t communicate fast enough? The copper connections between processors are struggling to keep up. Light offers a way forward—but connecting hundreds of optical fibers to a tiny chip requires extraordinary precision.

I worked with the founder throughout the funding round to build a coherent investment case.

Teramount develops optical connectors that let chips communicate using light, enabling faster, more efficient computing. Acquired by Molex in 2026.

A stylized chip diagram labeled “Legacy approach to Co-packaging” shows a central CPU die surrounded by smaller chips and multicolored optical lines entering from the right. Red text notes “Requires 1–2µm tight alignment tolerance” with an arrow pointing to the connection area.
Dark technical illustration of a chip-like module labeled “CPU” with multiple surrounding components and fiber cables attached on the right. Text reads “TERAVERSE” and “Detachable Fiber Connectivity.”
Grayscale close-up of a microfabricated device with a square platform on the left and repeating cylindrical structures with small raised tabs on the right.